P0082 E22F17C6N, DE0-Nano, Dev KIT TERASIC Technologies Shrink Temperature: 150°C

Shrink Temperature: 150°C

Dual Insulated

ONSEMI - MM3Z3V6T1G - Zener Single Diode

Reverse Bayonet

Product Range: LDT Series

P0082 E22F17C6N, DE0-Nano, Dev KIT TERASIC Technologies Shrink Temperature: 150°CTERASIC TECHNOLOGIES P0082 Development Kit, Altera Cyclone IV FPGA , DE0 Nano, 2x GPIO Headers, 32MB SDRAM, Accelerometer Silicon Manufacturer: Altera No. of Bits: Silicon Family Name: Cyclone IV E Core Architecture: FPGA Core Sub Architecture: Cyclone Silicon Core Number: EP4C Kit Contents: Altera DEO Nano Board, USB Mini B Cable, Quick Start Guide Product Range: SVHC: No SVHC (07 Jul 2017) Features: EP4CE22F17C6N FPGA, 2x GPIO Headers, 32MB RAM,